Lead Free Solder Sn96.5% / Ag3% / Cu0.5% (Part Numbers)
- Volume Discount
[Features]
· Features low-spatter flux.
· A JEITA recommended alloy lead free solder. Highly reliable and with a proven track record.
Part Number
Once your search is narrowed to one product,
the corresponding part number is displayed here.
HS-302
Basic information
| Lead Free | Corresponds To | Material | Sn96.5%/Ag3%/Cu0.5% |
|---|
This page is Lead Free Solder Sn96.5% / Ag3% / Cu0.5%, part number HS-302.
You can find the detail information about specifications and dimensions on part number HS-302.
- The specifications and dimensions of some parts may not be fully covered. For exact details, refer to manufacturer catalogs .
Variation of this product
| Part Number |
|---|
| HS-301 |
| HS-304 |
| HS-312 |
| HS-313 |
| HS-314 |
| HS-316 |
| Part Number | Standard Unit Price | Minimum order quantity | Volume Discount | Standard Shipping Days ? | RoHS | Type | Wire diameter (φ/mm) |
|---|---|---|---|---|---|---|---|
46.34 € | 1 | Available | 5 Days | 10 | Bobbin type M | 0.3 | |
33.61 € | 1 | Available | 5 Days | 10 | Bobbin type M | 1.0 | |
96.76 € | 1 | Available | 5 Days | 10 | Bobbin type L | 0.6 | |
91.35 € | 1 | Available | 5 Days | 10 | Bobbin type L | 0.8 | |
125.21 € | 1 | Available | 5 Days | 10 | Bobbin type L | 1.0 | |
176.51 € | 1 | Available | 7 Days | 10 | Bobbin type LL | 0.8 |
Tech Support
Payment Method
On-Demand Manufacturing
Certificates
Copyright © MISUMI Corporation All Rights Reserved.