Lead Free Solder Sn99.3% / Cu+Ni0.7%
Lead Free Solder/Flux Characteristics: RMA Composition: Sn 99.3% / Cu+Ni0.7%
[Features]
· Lead free solder with a glossy finish close to that of tin-lead solder.
· Solder with comparatively low rates of copper leaching and soldering iron tip damage.
[Features]
· Lead free solder with a glossy finish close to that of tin-lead solder.
· Solder with comparatively low rates of copper leaching and soldering iron tip damage.
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Basic information
| Type | Bobbin type M | Lead Free | Corresponds To |
|---|
- The specifications and dimensions of some parts may not be fully covered. For exact details, refer to manufacturer catalogs .
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