Heat Insulating Plates(Main Material:Silicic Acid Base Binder)

Data to be displayed
30
45
60
Shipping Days
  • All
  • 3 Days or Less
  • 4 Days or Less
  • 5 Days or Less
  • 7 Days or Less
  • 9 Days or Less
  • 10 Days or Less
  1. 1
Brand
Product Series
CAD
Starting from
Min. Shipping Days
Shape
Recommended Operating Temperature(℃)
Application
Main Material
Plate Thickness T(mm)
Width B(mm)
Length A(mm)
Hole Machined / Not Machined

    Heat Insulating Plates/Standard/Heat Resistant Grade

      Heat Insulating Plates/Circular

        Bakelite/Epoxy Glass/Insulating Types

        Brand

        MISUMI

        MISUMI

        MISUMI

        Product Series

        Heat Insulating Plates/Standard/Heat Resistant Grade

        Heat Insulating Plates/Circular

        Bakelite/Epoxy Glass/Insulating Types

        CAD
        • 2D / 3D
        • 2D / 3D
        • 2D / 3D
        Starting from

        -

        -

        -

        Min. Shipping Days 4 Days 7 Days 7 Days
        ShapePlate (Material)Circular PlatesPlate (Material)
        Recommended Operating Temperature(℃)Room Temp. ~ 220Room Temp. ~ 220Room Temp. ~ 220
        ApplicationStandardStandardStandard
        Main MaterialSilicic Acid Base BinderSilicic Acid Base BinderSilicic Acid Base Binder
        Plate Thickness T(mm)3 ~ 155 ~ 153 ~ 15
        Width B(mm)20 ~ 600--
        Length A(mm)20 ~ 800--
        Hole Machined / Not MachinedHole Machined / No HoleNo HoleHole Machined

        Loading...

        1. 1

        Categories related to Heat Insulating Plates