Thermal Conductive Adhesive, Epoxy Based
Solvent-free and thermal conductive two part adhesive
epoxy based filled with aluminium oxide
composition of hardener and resin (1:1) with statical mixing tube
lockability of the container via Luer-Lock System
good usage and working properties
store cool and dry
epoxy based filled with aluminium oxide
composition of hardener and resin (1:1) with statical mixing tube
lockability of the container via Luer-Lock System
good usage and working properties
store cool and dry
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Basic information
| Thermal Conductivity(W/m·K) | 1 | Temperature Range | -50 to +145 | Volume Resistance | 8·10^11 Ω/cm |
|---|---|---|---|---|---|
| Specific Thermal Resistance | 118°C cm/W | Hardening Time | 60°C approx. 4 h/25°C approx. 16 h | Mixture Proportion | 1:1 |
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