Precision Female Headers

Part Number

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the corresponding part number is displayed here.

Part Number
BLR 1 025 Z
BLR 2 050 Z
MK 01/01/G
MK 01/01/Z
MK 01/02/G
MK 01/02/Z
MK 01/03/G
MK 01/03/Z
MK 01/04/G
MK 01/04/Z
MK 01/05/G
MK 01/05/Z
MK 01/06/G
MK 01/06/Z
MK 01/07/Z
MK 01/08/Z
MK 01/10/Z
MK 01/20/Z
MK 01/32/G
MK 01/50/G
MK 01/50/Z
MK 06/20/Z
MK 07/05/Z
MK 07/09/Z
MK 13 X 2/02/G
MK 13 X 2/50/G
MK 17/02/Z
MK 21/02/Z
MK 21/03/Z
MK 21/04/Z
MK 21/05/Z
MK 21/10/Z
MK 21/40/Z
MK 21/50/Z
MK 23 SMD 04 Z B TR
MK 23 SMD/04/Z BSM
MK 23 SMD/08/Z BSM
MK 23 SMD/20/Z B TR
MK 24 SMD 03 Z
MK 25 SMD 04 Z
MK 221/10/Z
MK LP 18/02/G
MK LP 18/02/Z
MK LP 18/03/G
MK LP 18/03/Z
MK LP 18/04/G
MK LP 18/08/G
MK LP 18/10/Z
MK LP 18/12/G
MK LP 18/50/G
MK LP 18/50/Z
MK LP 19/02/G
MK LP 19/10/G
MK LP 19/20/G
MK LP 19/34/G
Part NumberRelated to
Standard Unit Price
Minimum order quantityVolume Discount
Standard
Shipping Days
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Temperature Range Nominal Current Nominal Voltage Insulating Body Material Test Voltage No. Of Contacts Specific Insulation Resistance Volume Resistance Grid
(mm)
Connection Type Version Surface Of Contact Capacity Between Two Adjacent Contacts
(pF)
Insertion / Drawing Force Type Internal Spring

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1 Quote -40°C to +105°C (260°C/10 s)1 A100 V DCPCT, GF500 V25-≤20 mΩ1.27THT (soldering)standard-≤1.01.2N/0.6N3-fingers

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1 Quote -40°C to +105°C (260°C/10 s)1 A100 V DCPCT, GF500 V50-≤20 mΩ1.27THT (soldering)standard-≤1.01.2N/0.6N3-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V1>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layergold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V1>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layertin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V2>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layergold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V2>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layertin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V3>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layergold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V3>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layertin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V4>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layergold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V4>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layertin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V5>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layergold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V5>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layertin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V6>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layergold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V6>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layertin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V7>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layertin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V8>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layertin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V10>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layertin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V20>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layertin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V32>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layergold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V50>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layergold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V50>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layertin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V20>10⁷ Ω·m≤10 mΩ2.54THT (soldering)solder and plug pins, Ø0.5mmtin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V5>107 Ω·m≤10 mΩ2.54THT (soldering)Wire wrap pin, □0.635mmtin-plated---

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V9>10⁷ Ω·m≤10 mΩ2.54THT (soldering)Wire wrap pin, □0.635mmtin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V2>10⁷ Ω·m≤10 mΩ2.54THT (soldering)distance pingold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V50>10⁷ Ω·m≤10 mΩ2.54THT (soldering)distance pingold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V2>10⁷ Ω·m≤10 mΩ2.54THT (soldering)for multi-layertin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)3 A150 V DCPA 4.6. GF1500 V2>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profile-≤0.31.3N/0.3N6-fingers

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100 Quote -40°C to +163°C (260°C/10 s)3 A150 V DCPA 4.6. GF1500 V3>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profile-≤0.31.3N/0.3N6-fingers

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100 Quote -40°C to +163°C (260°C/10 s)3 A150 V DCPA 4.6. GF1500 V4>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profile-≤0.31.3N/0.3N6-fingers

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100 Quote -40°C to +163°C (260°C/10 s)3 A150 V DCPA 4.6. GF1500 V5>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profile-≤0.31.3N/0.3N6-fingers

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100 Quote -40°C to +163°C (260°C/10 s)3 A150 V DCPA 4.6. GF1500 V10>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profile-≤0.31.3N/0.3N6-fingers

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100 Quote -40°C to +163°C (260°C/10 s)3 A150 V DCPA 4.6. GF1500 V40>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profile-≤0.31.3N/0.3N6-fingers

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100 Quote -40°C to +163°C (260°C/10 s)3 A150 V DCPA 4.6. GF1500 V50>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profile-≤0.31.3N/0.3N6-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V4>10⁷ Ω·m≤10 mΩ2.54SMDfemale header-≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V4>10⁷ Ω·m≤10 mΩ2.54SMDfemale header-≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V8>10⁷ Ω·m≤10 mΩ2.54SMDfemale header-≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V20>10⁷ Ω·m≤10 mΩ2.54SMDfemale header-≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)3 A150 V DCPA 4.6. GF1500 V3>10⁷ Ω·m≤10 mΩ2.54SMDfemale header-≤0.31.3N/0.3N6-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V4>10⁷ Ω·m≤10 mΩ2.54SMDfemale header-≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)3 A150 V DCPA 4.6. GF1500 V10>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profile-≤0.31.3N/0.3N6-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V2>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V2>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profiletin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V3>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V3>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profiletin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V4>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V8>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V10>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profiletin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V12>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V50>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V50>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profiletin-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V2>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V10>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V20>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.41.8 N/1.4 N4-fingers

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100 Quote -40°C to +163°C (260°C/10 s)1.5 A60 V DCPA 4.6. GF1000 V34>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.41.8 N/1.4 N4-fingers

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Basic information

Class Of Inflammability UL 94 V-0 Contact Material CuZn-alloy Reflow Solderable yes

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