Type | Material Surface Treatment Code | [M] Material |
HTPC | S | EN 1.4305 Equiv. |
Part Number | — | Plate | — | RC (PT) | — | N (Number of Cooler Holes) | — | P (Pitch) | ||||
A | — | B | — | T | ||||||||
HTPCS | — | 200 | — | 200 | — | 15 | — | R1 | — | N4 | — | P30 |
A | B | M1 |
50 to 100 | 50 to 100 | M4 × 0.7 Depth 6 |
101 to 200 | M5 × 0.8 Depth 8 | |
101 to 200 | 50 to 100 | |
101 to 200 | M6 × 1.0 Depth 10 |
Rc (PT) | (d) |
1 (1/8) | 8.5 |
2 (1/4) | 11.4 |
Part Number | 1 mm Increments | T 5 mm Increments | Rc (PT) | N Number of Cooler Holes | P 1 mm Increments | ||
Type | Material Code | A | B | ||||
HTPC | S | 50 to 200 | 50 to 200 | 15 to 30 | 1 (1/8) | 1 to 7 | 25 or more(A−25) |
20 to 30 | 2 (1/4) | ||||||
[ ! ] The distance from the upper, lower or side plate end faces to the cooler holes and tapped hole should be 2 mm or more. [ ! ] The distance between all holes (between cooler holes, or between cooler holes and tapped holes) should be 2 mm or more. |
● Thickness Parallelism | 0.015 or less per 100 mm | ||||||||
● Flatness |
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● Dimensional tolerance of A and B |
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● T Dimension Tolerance | ±0.1 | ||||||||
● Circumference Chamfering | C0.2 to C1.0 |