Lead Free Solder Sn99.3% / Cu+Ni0.7% (Part Numbers)
- Volume Discount
Lead Free Solder/Flux Characteristics: RMA Composition: Sn 99.3% / Cu+Ni0.7%
[Features]
· Lead free solder with a glossy finish close to that of tin-lead solder.
· Solder with comparatively low rates of copper leaching and soldering iron tip damage.
[Features]
· Lead free solder with a glossy finish close to that of tin-lead solder.
· Solder with comparatively low rates of copper leaching and soldering iron tip damage.
Part Number
Once your search is narrowed to one product,
the corresponding part number is displayed here.
HS-371
Basic information
| Type | Bobbin type M | Lead Free | Corresponds To |
|---|
This page is Lead Free Solder Sn99.3% / Cu+Ni0.7%, part number HS-371.
You can find the detail information about specifications and dimensions on part number HS-371.
- The specifications and dimensions of some parts may not be fully covered. For exact details, refer to manufacturer catalogs .
Variation of this product
| Part Number |
|---|
| HS-372 |
| HS-374 |
| Part Number | Standard Unit Price | Minimum order quantity | Volume Discount | Standard Shipping Days ? | RoHS | Wire diameter (φ/mm) |
|---|---|---|---|---|---|---|
31.29 € | 1 | Available | 5 Days | 10 | 0.6 | |
27.30 € | 1 | Available | 5 Days | 10 | 1.0 |
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