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Part Number
MK 02/02/Z
MK 02/08/Z
MK 02/50/G
MK 04/02/Z
MK 04/10/G
MK 05/01/G
MK 05/01/Z
MK 05/02/Z
MK 05/09/G
MK 05/10/Z
MK 05/12/G
MK 05/50/G
MK 14 X 2/04/G
MK 210/10/G
MK LP 40/02/Z
MK LP 41/02/G
MK LP 41/04/G
MK LP 41/04/Z
MK LP 41/05/G
MK LP 41/07/G
MK LP 41/07/Z
MK LP 41/08/G
MK LP 41/10/Z
MK LP 41/12/G
MK LP 41/14/G
MK LP 41/20/G
MK LP 41/32/G
MK LP 41/50/G
MK LP 43/05/Z
MK LP 241/12/Z
MK LP 241/22/G
SL 1/025/01/G
SL 1/025/01/Z
SL 1/025/02/G
SL 1/025/02/S
SL 1/025/02/Z
SL 1/025/03/G
SL 1/025/03/Z
SL 1/025/04/G
SL 1/025/04/Z
SL 1/025/05/G
SL 1/025/05/S
SL 1/025/05/Z
SL 1/025/06/G
SL 1/025/06/Z
SL 1/025/07/G
SL 1/025/07/Z
SL 1/025/08/G
SL 1/025/10/G
SL 1/025/11/G
SL 1/025/12/G
SL 1/025/12/Z
SL 1/025/13/G
SL 1/025/14/S
SL 1/025/16/Z
SL 1/025/36/G
SL 1/025/36/Z
SL 1/053/02/G
SL 1 053 04 G
SL 1/078/03/G
Part NumberRelated to
Standard Unit Price
Minimum order quantityVolume Discount
Standard
Shipping Days
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Temperature Range Contact Material Nominal Current Nominal Voltage Insulating Body Material Test Voltage No. Of Contacts Specific Insulation Resistance Volume Resistance Grid
(mm)
Connection Type Version Surface Of Contact Capacity Between Two Adjacent Contacts
(pF)

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V2>10⁷ Ω·m≤10 mΩ2.54THT (soldering)with soldering forktin-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V8>10⁷ Ω·m≤10 mΩ2.54THT (soldering)with soldering forktin-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V50>10⁷ Ω·m≤10 mΩ2.54THT (soldering)with soldering forkgold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V2>10⁷ Ω·m≤10 mΩ2.54THT (soldering)with solder-cuptin-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V10>10⁷ Ω·m≤10 mΩ2.54THT (soldering)with solder-cupgold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V1>10⁷ Ω·m≤10 mΩ2.54THT (soldering)solder and plug pins, Ø0.5mmgold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V1>10⁷ Ω·m≤10 mΩ2.54THT (soldering)solder and plug pins, Ø0.5mmtin-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V2>10⁷ Ω·m≤10 mΩ2.54THT (soldering)solder and plug pins, Ø0.5mmtin-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V9>10⁷ Ω·m≤10 mΩ2.54THT (soldering)solder and plug pins, Ø0.5mmgold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V10>10⁷ Ω·m≤10 mΩ2.54THT (soldering)solder and plug pins, Ø0.5mmtin-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V12>10⁷ Ω·m≤10 mΩ2.54THT (soldering)solder and plug pins, Ø0.5mmgold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V50>10⁷ Ω·m≤10 mΩ2.54THT (soldering)solder and plug pins, Ø0.5mmgold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V4>10⁷ Ω·m≤10 mΩ2.54THT (soldering)parallel PCB connectiongold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V10>10⁷ Ω·m≤10 mΩ2.54THT (soldering)with solder-cupgold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V2>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profiletin-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V2>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V4>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V4>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profiletin-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V5>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V7>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V7>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profiletin-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V8>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V10>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profiletin-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V12>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V14>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V20>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V32>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V50>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V5>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profiletin-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V12>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profiletin-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuZn-alloy1.5 A60 V DCPA 4.6. GF1000 V22>10⁷ Ω·m≤10 mΩ2.54THT (soldering)low profilegold-plated≤0.4

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V1>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardgold-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V1>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardtin-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V2>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardgold-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V2>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardselective gold-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V2>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardtin-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V3>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardgold-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V3>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardtin-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V4>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardgold-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V4>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardtin-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V5>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardgold-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V5>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardselective gold-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V5>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardtin-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V6>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardgold-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V6>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardtin-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V7>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardgold-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V7>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardtin-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V8>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardgold-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V10>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardgold-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V11>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardtin-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V12>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardgold-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V12>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardtin-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V13>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardgold-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V14>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardselective gold-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V16>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardtin-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V36>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardgold-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V36>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardtin-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V2>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardgold-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V4>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardgold-plated-

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100 Quote -40°C to +163°C (260°C/10 s)CuSn alloy3 A250 V ACPA 4.6. GF2000 V3>10⁷ Ω·m≤5 mΩ2.54THT (soldering)standardgold-plated-

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Basic information

Class Of Inflammability UL 94 V-0 Reflow Solderable yes

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