Heat Insulating Plates(Recommended Operating Temperature:-80-400)

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Brand
Product Series
CAD
Starting from
Min. Shipping Days
Shape
Recommended Operating Temperature(℃)
Application
Main Material
Plate Thickness T(mm)
Width B(mm)
Length A(mm)
Hole Machined / Not Machined

    Heat Insulating Plates/High Strength/High Temperature Resistant Grade

      Heat Insulating Plates/High Temperature Insulating Grade/With/Without Holes

        Bakelite/Epoxy Glass/Insulating Types

        Brand

        MISUMI

        MISUMI

        MISUMI

        Product Series

        Heat Insulating Plates/High Strength/High Temperature Resistant Grade

        Heat Insulating Plates/High Temperature Insulating Grade/With/Without Holes

        Bakelite/Epoxy Glass/Insulating Types

        CAD
        • 2D / 3D
        • 2D / 3D
        • 2D / 3D
        Starting from

        -

        -

        -

        Min. Shipping Days 7 Days 4 Days 7 Days
        ShapePlate (Material)Plate (Material)Plate (Material)
        Recommended Operating Temperature(℃)-80-400-80-400-80-400
        ApplicationHigh Temperature ResistanceHigh Temperature ResistanceHigh Temperature Resistance
        Main MaterialCalcium Silicate Base BinderCalcium Silicate Base BinderCalcium Silicate Base Binder
        Plate Thickness T(mm)3 ~ 151 ~ 23 ~ 15
        Width B(mm)20 ~ 60020 ~ 500-
        Length A(mm)20 ~ 80020 ~ 500-
        Hole Machined / Not MachinedHole MachinedHole Machined / No HoleHole Machined

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