Thermal Conductive Adhesive

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WLK 5
WLK 10
WLK 30
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Composition

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1 Quote 5 g resin/0.5 g hardener

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1 Quote 10 g resin/1 g hardener

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1 Quote 30 g resin/3 g hardener

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Basic information

Thermal Conductivity(W/m·K) 0.836 Temperature Range -56 to +149 Volume Resistance 10^16 Ω/cm
Specific Thermal Resistance 1.2 m·K/W Hardening Time 20°C approx. 16-24h / 25°C approx. 8 h / 120°C approx. 20 min Mixture Proportion 10:1

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